HSFECL five-to-one black epoxy potting compound packaging for electronic encapsulation

5:1 BLACK EPOXY POTTING COMPOUND - B2B SUPPLY

5:1 Black Epoxy Potting Compound for Electronic Encapsulation

Two-component 5:1 black epoxy potting compounds for selected PCB assemblies, LED modules, sensors, power supplies and electronic components requiring hard cured encapsulation, electrical insulation and flame-retardant grade review.

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Need a different viscosity, cure behavior or performance direction? Discuss a Custom Potting Formula

5:1 Weight Ratio
Black Hard-Cure System
Manual & Machine Dispensing
Bulk & Packaging Support

Product Type: 5005AB / 105AB black epoxy potting compounds
Mix Ratio: 5:1 by weight
Cured Character: Hard cured result
Primary Positioning: Insulation, hard encapsulation and flame-retardant grade options
Application Direction: PCB, LED, sensors and power supplies
Supply Options: Samples, bulk packaging and formulation review

PRODUCT POSITIONING

Black Hard-Cure Epoxy for Selected Electronic Encapsulation

The 5005AB and 105AB systems are both 5:1 black epoxy potting compounds for selected electronic assemblies requiring insulation, hard cured encapsulation and flame-retardant grade review.

5005AB is positioned for high-hardness electronic potting. 105AB is positioned as a black flame-retardant hard epoxy potting compound. Final use should be confirmed by module testing and matching TDS or report review.

Black Encapsulation Appearance
Hard Cured Structure
Flame-Retardant Grade Options
5:1 Weight Ratio
Manual and Machine Dispensing Evaluation
Bulk B2B Supply

TECHNICAL DATA

Black Epoxy Potting Compound Technical Overview

Compare the two current black epoxy potting compound options by model, viscosity, working time, curing reference, hardness, electrical data and flame-retardant positioning.

5005AB BLACK EPOXY POTTING COMPOUND

5005AB High-Hardness Electronic Potting

5:1 black epoxy system for electronic potting applications requiring insulation, high hardness and electronic encapsulation evaluation.

Model	5005A / 5005B
Product Type	Two-component black epoxy potting compound
Mix Ratio	5:1 by weight
Appearance	5005A: black; 5005B: brown
Viscosity at 25 C	5005A: 1300-1400 mPa.s; 5005B: 50-100 mPa.s
Specific Gravity	5005A: 1.7 +/- 1 g/cm3; 5005B: 1.1 +/- 0.1 g/cm3
Working Time	60-80 minutes at 25 C, 50 g reference
Curing Reference	8-16 hours
Cured Hardness	Shore D 80
Mechanical References	Bonding strength 145-165 kg/cm2; flexural strength 235-245 kg/cm2; shear strength 95-115 kg/cm2
Electrical References	Surface resistance 1 x 10^14 ohm/cm2; volume resistance 3 x 10^13 ohm/cm2; dielectric constant 4.2; breakdown voltage above 22 kV/mm
Flame-Retardant Grade	Flame-retardant grade available; confirm matching report for specification use
Storage	Store sealed away from light at 25 C and relative humidity below 70%; keep Part B sealed against moisture

105AB FLAME-RETARDANT BLACK EPOXY POTTING COMPOUND

105AB Flame-Retardant Hard Potting

5:1 black flame-retardant hard epoxy resin for electronic components requiring potting with room-temperature or heat-assisted curing.

Model	105A / 105B
Product Type	Two-component black flame-retardant hard epoxy potting compound
Mix Ratio	A:B = 100:20 by weight, equivalent to 5:1
Appearance	105A: black liquid; 105B: transparent yellow-brown liquid
Viscosity at 25 C	105A: 1000-1200 mPa.s; 105B: 100-200 mPa.s
Shelf Life at 25 C	105A: 6 months; 105B: 6 months
Working Time	30 minutes at 25 C, 100 g mixed quantity reference
Curing Reference	20 g room-temperature reference: 4 hours initial cure, 24 hours full cure; 60 C heat-assisted full cure in 2 hours
Cured Hardness	Shore D >75
Electrical References	Breakdown voltage 22 kV/mm; volume resistance 1 x 10^15 ohm reference; surface resistance 5 x 10^15 ohm reference
Mechanical References	Flexural strength 23 kg/mm2 reference
Flame-Retardant Grade	Flame-retardant grade available; UL 94 V-0 reference should be confirmed against the selected model and supply batch

The UL 94 report available in the current document set records V-0 for epoxy glue model E46-11702-01. For procurement or certification use, confirm the matching TDS and report for the selected 5005AB or 105AB supply batch.

APPLICATION EXAMPLES

Typical Electronic Encapsulation Applications

Designed for selected electronic encapsulation and component-protection applications after technical and production testing.

PCB Assemblies
LED Modules
LED Lighting Components
Sensors
Power Supplies
Control Modules
Electronic Housings
Selected Electrical Components

Black epoxy potting compound encapsulating a printed circuit board inside an electronic housing — Application images illustrate encapsulation direction; final suitability depends on component design and test requirements.

PRODUCT BOUNDARY

Potting Compound Is Not the Same as Conformal Coating or Adhesive

This page covers a black epoxy potting compound. It should not be described as a conformal coating, thermal adhesive or universal electronic sealant.

Electronic Potting Compound

Fills a cavity or housing around selected components and creates a cured encapsulation mass.

Conformal Coating

A much thinner protective coating applied over the surface of a circuit assembly.

Structural or Thermal Adhesive

Designed primarily to bond components or transfer heat, depending on the exact product.

BEFORE SAMPLE TESTING

Technical Requirements to Confirm Before Product Selection

Listing a requirement does not mean the current standard product already meets it. Share the target specification so HSFECL can review the standard formula or discuss a selected formulation adjustment.

01
Component or Module Type
02
Potting Volume and Depth
03
Manual or Machine Dispensing
04
Room-Temperature or Heat-Assisted Cure
05
Required Cured Hardness
06
Required Working Time
07
Electrical Requirements
08
Electrical Insulation Requirements
09
Flame-Retardant Requirements
10
Compliance or Test-Report Requirements

Share My Technical Requirements

PRODUCTION CONDITIONS

Component Preparation and Process Control Affect the Result

Final encapsulation quality depends on component cleanliness, housing geometry, mixing accuracy, dispensing method and curing conditions.

Clean and Dry Components
Accurate 5:1 Weight Ratio
Thorough Uniform Mixing
Controlled Potting Volume
Air-Release Evaluation
Controlled Curing Environment

Air release depends on product viscosity, mixing method, geometry and process conditions.

PACKAGING & B2B SUPPLY

Samples, Bulk Packaging and Repeat Potting Compound Supply

HSFECL supports electronic-product manufacturers, module factories, importers, distributors and product brands requiring sample evaluation, technical-data review, bulk packaging and repeat purchasing.

Packaging and purchasing arrangements depend on the current formula, estimated quantity, destination market and buyer requirements.

Request Packaging and Quotation Information

01Product Sample Evaluation
Test the material in your actual module and production process.
02Bulk Packaging
Packaging direction can be discussed after quantity and formula confirmation.
03Package Size Matching
Package planning depends on buyer market and production use.
04Private Label Discussion
Selected private-label requirements may be reviewed for repeat supply.
05Repeat Supply Planning
Coordinate sample testing, order planning and repeat procurement.
06Technical Data Support
Request the matching product TDS before specification or production use.
07Formulation Review
Selected project requirements can be reviewed for formula adjustment direction.

SELECTED FORMULATION REVIEW

Need a Different Viscosity, Cure Speed or Cured Performance?

For selected electronic encapsulation projects, formulation adjustment may be discussed after reviewing the component, dispensing process, potting volume, curing requirements and target performance.

Discuss a Custom Potting Formula

Viscosity
Working Time
Cure Behavior
Cured Hardness
Color
Packaging

PRODUCT NOTES

Accurate Mixing and Material Control Are Essential

Maintain the exact 5:1 weight ratio by weight.
Keep Part A and Part B sealed before use.
Avoid moisture and cross-contamination.
Mix material from the container walls and bottom thoroughly.
Temperature affects viscosity, working time and curing.
Mixed volume and housing geometry affect processing behavior.
Test the actual electronic module before mass production.
Follow the current matching product TDS.

PRODUCT FAQ

Questions About 5:1 Black Epoxy Potting Compound

What is the mix ratio of this black epoxy potting compound?

Both listed systems use a 5:1 weight-ratio direction. 105AB is specified as A:B = 100:20 by weight, which is equivalent to 5:1.

Does the product cure black?

Yes. 5005AB and 105AB are both positioned as black epoxy potting compounds for electronic encapsulation.

Is the cured result hard or flexible?

Both listed systems are hard-cure potting compounds. 5005AB is listed at Shore D 80, and 105AB is listed at Shore D >75.

Which electronic components can be potted?

PCB assemblies, LED modules, sensors, power supplies, control modules and selected electrical components may be evaluated after application testing.

Can it be used with an automatic dispensing machine?

The product may be evaluated for machine dispensing. Final compatibility depends on metering accuracy, viscosity, equipment design and production parameters.

Is this product thermally conductive?

Thermal conductivity must be confirmed using the exact current product TDS or a separately reviewed formula.

Is it flame retardant?

Both 5005AB and 105AB can be discussed as flame-retardant grade options. For specification use, confirm the matching TDS and UL 94 report against the selected model and supply batch.

Does it have confirmed electrical insulation data?

Yes. 5005AB includes surface resistance, volume resistance, dielectric constant and breakdown-voltage references. 105AB includes breakdown-voltage, volume-resistance and surface-resistance references.

Can the viscosity or curing behavior be adjusted?

Selected formulation adjustment may be discussed after reviewing the component, potting volume, dispensing process and target performance.

Can I request a sample and TDS?

Yes. Buyers can request a sample, current technical data review and packaging information for evaluation.

Do you support bulk packaging?

Bulk packaging can be discussed based on current formula, estimated quantity, destination market and repeat purchasing requirements.

POTTING SAMPLE & B2B SUPPLY

Request 5:1 Black Epoxy Potting Compound Support

Share your electronic encapsulation application, purchasing quantity and main requirement. If you selected a sample or technical-data action above, that context will be included automatically.

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